제품

글로벌 초과 및 구식 집적 회로(IC) 매입, 자산 회수 및 재활용 솔루션--en

잉여, 느리게 움직이는 및 수명 종료(EOL) 집적 회로(IC)를 즉각적인 현금 흐름으로 전환하세요. 우리는 OEM, EMS 제공업체, ODM 및 글로벌 유통업체를 위한 안전하고 인증된 B2B 반도체 자산 회수 및 친환경 전자 부품 재활용 서비스를 제공합니다. 투명한 평가, 선지급, 엄격한 위조 방지 테스트 및 국제 환경 준수를 통해 재무 회수를 극대화하세요.

제품 상세 정보

Integrated Circuit (IC) Asset Recovery & Liquidation
1. Introduction: Unlocking Latent Value in Semiconductor Excess
In the fast-moving electronics and semiconductor industry, rapid engineering iterations, unpredictable demand swings, and sudden supply-chain realignments frequently leave manufacturers burdened with dormant component inventory. Millions of authentic, high-value Integrated Circuits (ICs) sit immobilized in climate-controlled warehouses across the globe.

Carrying excess integrated circuits ties up vital working capital, inflates warehouse storage and insurance overhead, and subjects company assets to the risk of continuous balance-sheet write-downs. Our dedicated B2B semiconductor asset recovery division bridges the gap between dormant factory overstock and the global spot market. We provide a compliant, high-yield channel for supply chain executives, purchasing managers, and asset recovery specialists to liquidate idle silicon assets, recover maximum residual value, and support closed-loop circular economy initiatives.

2. Comprehensive IC Categories We Actively Purchase
Our procurement teams continuously source active, passive, legacy, and discontinued integrated circuits across all primary technology segments:

3. Accepted Component Packages and Packaging Standards
We buy integrated circuits across all standardized surface-mount technology (SMT) and through-hole technology (THT) form factors:

Surface-Mount Devices (SMT): BGA, FBGA, LGA, QFP, LQFP, TQFP, QFN, DFN, SOP, SSOP, TSSOP, SOT-23, and SOT-223.

Through-Hole Devices (THT): DIP, PDIP, CDIP, TO-220, and TO-247 configurations.

Packaging Media: Full Tape & Reel, partial reels with intact leader and trailer tapes, JEDEC standard plastic trays, anti-static tubes/sticks, and sealed moisture barrier bags (MBB) with active desiccant pouches.

4. Versatile Liquidation & Buyback Frameworks
Because corporate policies differ across tax considerations, risk thresholds, and balance-sheet needs, we structure versatile liquidation options:

Outright Cash Purchase (Immediate Settlement): The ideal solution for companies requiring instant cash flow and immediate warehouse clearance. Send us your component bill of materials (BOM), and we will provide an all-in cash valuation within 24 to 48 hours. Funds are settled via bank wire transfer (T/T) or commercial Escrow prior to cargo pickup.

Consignment Inventory Management: Designed for active, high-demand IC families where achieving maximum return takes precedence over instant settlement. Your components are securely held in our ANSI/ESD S20.20-compliant facilities and marketed through our proprietary international network of verified tier-1 buyers, providing regular profit disbursements.

Lot Buyout & Factory Line Clearing: Tailored for manufacturing line closures, company restructuring, and complete end-of-life write-offs. We acquire both fast-moving components and slow-moving or mature silicon in a single consolidated purchase package.

Precious Metal Recovery & Scrap Refining: Non-functional lots, assembly dropouts, cut tape strips, and broken components are processed through certified hydrometallurgical refining channels. We extract precious gold wire bonds, silver traces, and copper lead frames, delivering scrap value compensation alongside verified certificates of destruction.

5. Stringent Quality Assurance & Counterfeit Mitigation
Secondary market security requires rigorous inspection standards. Every lot received at our distribution hubs passes multi-stage verification adhering to IDEA-STD-1010 and AS6081 protocols:

Packaging & Label Audit: Detailed verification of factory bar codes, 2D data matrices, lot numbers, moisture sensitivity levels (MSL), and original factory tape seals.

Optical Microscopic Inspection: High-magnification surface checks to identify signs of sanding, blacktopping, acid etching, altered markings, bent leads, or pin re-tinning.

Radiographic (X-Ray) Imaging: Non-destructive structural inspection to verify internal die dimensions, lead-frame designs, and bond-wire integrity against original component benchmarks.

Decapsulation & Die Authentication: When necessary, selective chemical etching exposes the silicon die to authenticate manufacturer trademarks, mask revisions, and proprietary die markers.

6. Logistics, Global Trade Compliance, and Environmental Standards
Executing international semiconductor recovery operations requires strict regulatory discipline:

Global Freight Management: We coordinate door-to-door transit, export declarations, and fully insured international logistics via carriers such as DHL, FedEx, UPS, and certified air-freight forwarders.

ESD & MSL Protection: Warehoused inventories are maintained in static-safe environments and stored in dry-storage cabinets compliant with IPC/JEDEC J-STD-033 moisture guidelines.

International Export Compliance: We strictly follow global trade laws, including US EAR, European Dual-Use regulations, and Wassenaar Arrangement rules. We never divert controlled computing or RF technologies to restricted parties.

Zero-Landfill Commitment: All unmarketable electronic scrap is processed through ISO 14001 and R2-aligned recycling lines, preventing toxic materials and heavy metals from entering municipal landfills.

7. Straightforward 4-Step Buyback Process
Monetizing your excess integrated circuits is clear, fast, and structured:

Submit Excess Manifest: Upload your list in Excel or CSV format containing Manufacturer Part Numbers (MPN), quantities, date codes (D/C), brand names, and packaging types.

24-48h Valuation: Our valuation specialists examine real-time global spot demand, factory lead times, and transaction histories to return a competitive cash offer.

Payment & Freight Pickup: Upon agreement, we disburse funds and schedule commercial carrier pickups directly from your shipping docks.

In-House Audit: Upon delivery, products undergo final receiving verification, followed by lot closure reports and certified destruction documentation if requested.

Frequently Asked Questions (FAQ)
Do you purchase older date code or obsolete integrated circuits?
Yes. Many aerospace, industrial, automation, and medical platforms have extended lifecycles and depend on discontinued date codes to avoid costly system redesigns. We actively buy mature and obsolete components.

Can we sell mixed component lots from different brands together?
Yes. You can consolidate microcontrollers, analog chips, memory modules, and logic devices from diverse manufacturers into a single excess manifest for unified valuation and pickup.

What details are required to obtain a formal purchase offer?
To receive the fastest and most accurate valuation, please provide the Complete Manufacturer Part Number (MPN), Brand, Quantity, Date Code (D/C), Package Style, and current inventory location.

회사 소개

회사 소개
선전 TSD 기술 유한회사는 2005년에 설립되었으며 중국에서 가장 선도적인 전자 부품 유통업체 중 하나로, 최근 몇 년간 빠르게 성장하고 발전하여 귀하의 종합 글로벌 공급망 파트너가 되었습니다. 이 회사는 전 세계 전자 ODM/OEM/EMS 고객을 위한 공급망 서비스를 제공합니다. 설립 이래로 TsdTech는 글로벌 반도체 산업의 발전과 글로벌 첨단 기술 산업에 미치는 영향에 항상 관심을 가져왔으며, 세계 선도 전자 부품 제품의 응용 기술로 글로벌 첨단 기술 기업에 봉사하는 데 전념하고 있습니다. 이 회사는 대량의 신제품 원재고를 보유하고 있으며, 200개 이상의 SMT 공장과 성공적으로 연결되어 4000개 이상의

자주 묻는 질문

TSDTech는 전력 관리 IC, 마이크로컨트롤러(MCU), 통신 IC, MOSFET, 정류기 브리지, IGBT 및 자동차 전자 부품을 포함한 다양한 전자 부품을 공급합니다.

TSDTech의 제품 포트폴리오에는 Texas Instruments (TI), Analog Devices (ADI), NXP, STMicroelectronics (ST), Microchip, Atmel, Infineon, Renesas와 같은 주요 반도체 브랜드의 부품이 포함되어 있습니다.

TSDTech는 고객의 소싱 요구를 지원하기 위해 상당한 양의 새로운 정품 전자 부품 재고를 유지하고 있습니다. 고객은 특정 부품 번호에 대한 제품 가용성, 사양 및 소싱 옵션을 확인하기 위해 팀에 연락할 수 있습니다.

TSDTech는 글로벌 전자 ODM, OEM, EMS 고객뿐만 아니라 다양한 부품 조달 요구가 있는 중소 전자 제조업체를 위한 공급망 서비스를 제공합니다.

네. TSDTech는 기업 고객을 위한 대량 부품 조달 및 공급을 지원합니다. 주문 수량, 재고 가용성, 가격 및 배송 일정은 특정 부품 번호와 프로젝트 요구 사항에 따라 논의할 수 있습니다.

네. TSDTech는 여러 제품 카테고리와 반도체 브랜드에 걸쳐 전자 부품 조달을 고객에게 지원합니다. 고객은 조달 지원을 위해 자재 명세서(BOM) 또는 필요한 부품 번호 목록을 제출할 수 있습니다.

2005년 설립 이후, TSDTech는 200개 이상의 SMT 공장과 연결되었으며, 4,000개 이상의 중소 단말기 제조업체의 요구를 지원해 왔다고 회사 정보에 나와 있습니다.

TSDTech는 업계 경험, 광범위한 부품 포트폴리오, 원본 재고 자원, 그리고 확립된 고객 네트워크를 결합합니다. 이 회사는 정직한 비즈니스 관행과 글로벌 전자 제조업체의 다양한 소싱 요구를 지원하는 데 전념하고 있습니다.